本課程讓學生了解基礎製造程序、加工技術原理與種類、品檢量測技術及公差配合應用、半導體製程的環境、上中下游產業鏈的製程流程等產業資訊，培養學生於規劃時將製程整合其中，以利於學生具備實務能力。
This course allows students to understand the basic manufacturing procedures, processing technology principles and types, product testing technology and tolerance coordination applications, semiconductor process environment, upstream, midstream and downstream industrial chain process processes and other industry information, and train students to integrate the process during planning to facilitate students to have practical capabilities.
本課程旨在介紹製造程序規劃的相關知識，包括製程規劃步驟與實施方法、品質檢驗、特殊加工技術等，經由原理的介紹和查核表的使用，使同學們能瞭解如何執行製造程序規劃。
This course aims to introduce relevant knowledge about manufacturing program planning, including process planning steps and implementation methods, quality inspection, special processing techniques, etc. Through the introduction of principles and the use of verification tables, students can understand how to execute manufacturing program planning.
自編教材
Self-edited textbooks
| 評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
|---|---|---|
| 各科老師自訂各科老師自訂 Customized by teachers of various subjects |
50 | |
| 各科老師自訂各科老師自訂 Customized by teachers of various subjects |
50 |
