5831 - Semiconductor Packaging 英授 Taught in English
Semiconductor Packaging
教育目標 Course Target
This course aims to provide students with an understanding of the evolution of electronic packaging technologies, covering various package structures and their applications, including flip-chip packaging, wafer-level packaging (WLP), three-dimensional integrated packaging (3D packaging), and fan-out packaging technologies and structures.
This course aims to provide students with an understanding of the evolution of electronic packaging technologies, covering various package structures and their applications, including flip-chip packaging, wafer-level packaging (WLP), three-dimensional integrated packaging (3D packaging), and fan-out packaging technologies and structures.
參考書目 Reference Books
Lau, John H., Semiconductor Advanced Packaging, Springer, 2021.
Lau, John H., Semiconductor Advanced Packaging, Springer, 2021.
評分方式 Grading
| 評分項目 Grading Method |
配分比例 Percentage |
說明 Description |
|---|---|---|
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Attendance Attendance |
20 | |
|
Assignments Assignments |
20 | |
|
Midterm Exam Midterm Exam |
25 | |
|
Final Exam Final Exam |
25 | |
|
Flexible Learning Activities Flexible Learning Activities |
10 |
授課大綱 Course Plan
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相似課程 Related Courses
無相似課程 No related courses found
課程資訊 Course Information
基本資料 Basic Information
- 課程代碼 Course Code: 5831
- 學分 Credit: 3-0
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上課時間 Course Time:Wednesday/2,3,4
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授課教師 Teacher:田青禾
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修課班級 Class:半導體碩1
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選課備註 Memo:請至半導體學程系辦進行人工加選。
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