本課程（國際半導體碩士專班的產業實習）旨在透過「雙軌輔導與做中學（Learning by Doing）」的產學合作教學模式，培育具備高度實務戰力之高階半導體封裝人才。學生將前往矽品精密工業股份有限公司進行駐廠實習，在企業指派之資深工程師或主管（業師）指導下進行實務專案訓練。課程內涵涵蓋先進封裝製程操作、材料特性分析與封裝缺陷檢測等技術實作。學生須將研究所階段所學的電子材料、電化學、高等輸送現象、半導體元件物理、先進封裝半導體、材料科學等學科知識與產線實務結合。課程尤其著重於實際產線問題的解決，透過專案導向學習（PBL），學生將在真實工業環境中執行製程參數最佳化、材料分析與失效分析(FA)等專案，進而縮短未來進入職場的學用落差。

This course (Industrial Internship for the International Semiconductor Master's Program) aims to cultivate high-level semiconductor packaging talents with high practical capabilities through the industry-university cooperative teaching model of "dual-track tutoring and learning by doing (Learning by Doing)". Students will go to Silicon Precision Industry Co., Ltd. for factory internship and conduct practical project training under the guidance of senior engineers or supervisors (industry engineers) assigned by the company. The content of the course covers technical implementation such as advanced packaging process operations, material property analysis, and packaging defect detection. Students are required to combine the knowledge of electronic materials, electrochemistry, advanced transport phenomena, semiconductor component physics, advanced packaging semiconductors, materials science and other subjects learned in the graduate school with production line practice. The course particularly focuses on solving actual production line problems. Through Project-Based Learning (PBL), students will perform projects such as process parameter optimization, material analysis and failure analysis (FA) in a real industrial environment, thereby shortening the learning-application gap when entering the workplace in the future.

本實習課程以產線實務與企業內部規範為主、學理文獻為輔
1. 企業內部機密與標準文件： 矽品精密工業內部之標準作業流程(SOP)、製造執行系統(MES)操作手冊、以及SPC (統計製程管制) 與 OOC (失控) 標準處置流程文件。此類資料屬企業營業機密，僅限實習期間於廠區內參閱。
2. 封裝技術與材料科學基礎教材：
Tummala, R. R. (2001). Fundamentals of Microsystems Packaging. McGraw-Hill. (提供傳統與先進封裝流程之理論基礎)。
3. 統計與實驗設計參考書： Montgomery, D. C. (2019). Introduction to Statistical Quality Control. (對應課程中大量實驗數據收集、工廠常用SPC系統及DOE實驗設計之學習)。

This internship course focuses on production line practices and internal corporate regulations, supplemented by academic literature
1. Internal corporate confidentiality and standard documents: Silicon Precision Industry’s internal standard operating procedures (SOP), manufacturing execution system (MES) operation manual, and SPC (statistical process control) and OOC (out of control) standard processing process documents. Such information is corporate business secrets and can only be viewed within the factory during the internship period.
2. Basic textbooks on packaging technology and materials science:
Tummala, R. R. (2001). Fundamentals of Microsystems Packaging. McGraw-Hill. (Providing a theoretical foundation for traditional and advanced packaging processes).
3. Reference book on statistics and experimental design: Montgomery, D. C. (2019). Introduction to Statistical Quality Control. (corresponding to the study of large amounts of experimental data collection, commonly used SPC systems in factories, and DOE experimental design in the course).