本課程旨在為學生建立電機電子領域積體電路製程整合所需的專業知識與實際應用，內容涵蓋半導體元件製程之基本原理、製程流程整合、薄膜沉積、微影製程、蝕刻技術、摻雜與熱處理，以及金屬化與封裝等關鍵技術。課程同時介紹各製程步驟間之整合關係與製程參數對元件特性之影響，使學生了解積體電路與半導體元件之完整製造流程。

This course aims to provide students with the professional knowledge and practical applications required for integrated circuit process integration in the field of electromechanical electronics. The content covers the basic principles of semiconductor device manufacturing, process flow integration, thin film deposition, lithography process, etching technology, doping and heat treatment, as well as key technologies such as metallization and packaging. The course also introduces the integrated relationship between each process step and the impact of process parameters on device characteristics, allowing students to understand the complete manufacturing process of integrated circuits and semiconductor devices.

1.自編數位教材
2.半導體製程與整合，台灣半導體研究中心。
3.蕭宏，半導體製程技術導論 (第三版)

1. Self-compiled digital teaching materials
2. Semiconductor process and integration, Taiwan Semiconductor Research Center.
3. Xiao Hong, Introduction to Semiconductor Process Technology (Third Edition)