本課程的內容規畫旨在為學生建立半導體製程設備與in-situ即時檢測的整合性知識。內容涵蓋無塵室規範、晶圓潔淨、PVD/CVD、擴散、蝕刻等主要製程設備原理，並著重於in-situ膜厚、光譜、電漿與XPS等即時監控技術。
本課程教授目標旨在本課程旨在為學生建立半導體製程設備與in-situ檢測監控的知識。課程內容涵蓋無塵室規範、晶圓潔淨與各類沉積、蝕刻、擴散製程設備原理，並著重於in-situ膜厚、光譜、電漿製程應用XPS分析技術進行即時監控。期望學生能透過本課程，理解製程設備的運作，並具備運用先進檢測技術提升製程良率與品質，為未來從事半導體產業職涯奠定良好基礎。

The content planning of this course aims to provide students with integrated knowledge of semiconductor processing equipment and in-situ real-time inspection. The content covers major process equipment principles such as clean room specifications, wafer cleaning, PVD/CVD, diffusion, and etching, and focuses on real-time monitoring technologies such as in-situ film thickness, spectrum, plasma, and XPS.
The teaching objectives of this course are to provide students with knowledge of semiconductor process equipment and in-situ inspection and monitoring. The course content covers clean room specifications, wafer cleaning, and various deposition, etching, and diffusion process equipment principles, and focuses on in-situ film thickness, spectrum, and plasma process application XPS analysis technology for real-time monitoring. It is expected that students can understand the operation of process equipment through this course and be able to use advanced detection technology to improve process yield and quality, laying a good foundation for their future careers in the semiconductor industry.

旨在為學生建立半導體製程設備與in-situ即時檢測技術之全面性知識。課程首先探討半導體產業趨勢與製程技術概論，為學生建立宏觀視野。課程將深入介紹無塵室規範與晶片潔淨等基礎環節，進而涵蓋各項關鍵製程設備，如物理氣相沉積 (PVD)、化學氣相沉積 (CVD)、高溫擴散、離子佈植、奈米級曝光顯影、電漿製程與乾蝕刻。課程特別強調各項半導體製程設備與in-situ即時監控技術的整合應用，包括膜厚、光譜及in-situ XPS等分析方法，以確保製程品質與良率。本課程的目標為期使學生在修習課課後具備獨立分析與解決製程問題的能力，可勝任半導體產業研發、製程或設備工程等相關職務。

It aims to provide students with comprehensive knowledge of semiconductor process equipment and in-situ real-time detection technology. The course first discusses semiconductor industry trends and an introduction to process technology to establish a macro perspective for students. The course will provide an in-depth introduction to basic aspects such as clean room specifications and wafer cleaning, and then cover key process equipment, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), high-temperature diffusion, ion implantation, nanoscale exposure and development, plasma processing and dry etching. The course particularly emphasizes the integration and application of various semiconductor process equipment and in-situ real-time monitoring technology, including analysis methods such as film thickness, spectrum, and in-situ XPS, to ensure process quality and yield. The goal of this course is to enable students to have the ability to independently analyze and solve process problems after taking the course, and to be qualified for semiconductor industry R&D, process or equipment engineering and other related positions.

1.蕭宏，半導體製程技術導論(第四版)，全華圖書。
2.楊子明、鍾昌貴、沈志彥、李美儀、吳鴻佑、詹家瑋，半導體製程設備技術(3版)，全華圖書。
3.Martin Mason，從被動回應到即時監測，乃至主動預測：原位半導體計量的新時代，EET 電子工程專輯。
4.Toru Shimizu，電漿和非電漿製程中in-situ製程監控技術，科儀新知。
5.其他期刊文獻。

1. Xiao Hong, Introduction to Semiconductor Process Technology (Fourth Edition), Quanhua Books.
2. Yang Ziming, Zhong Changgui, Shen Zhiyan, Li Meiyi, Wu Hongyou, Zhan Jiawei, Semiconductor Process Equipment Technology (3rd Edition), Quanhua Books.
3.Martin Mason, From passive response to real-time monitoring and even proactive prediction: a new era of in-situ semiconductor metrology, EET Electronic Engineering Issue.
4.Toru Shimizu, in-situ process monitoring technology in plasma and non-plasma processes, New Knowledge from Science and Technology.
5. Other journal documents.