本課程旨在使學生理解 2010 年後主流與先進半導體製程技術之核心概念與應用。內容涵蓋基礎半導體知識、主要模組製程，以及二維平面式與三維鰭式電晶體之製程整合。課程亦介紹受應力矽通道、高介電閘極氧化層、金屬閘極、先進源汲極工程等關鍵技術，並說明 SEM、TEM、XPS、拉曼光譜等材料分析手法與其應用。最後，課程將引導學生認識未來技術方向，包括 GAAFET、CFET、垂直通道元件與3D IC等，以建立學生對半導體製程演進的整體理解。

This course aims to enable students to understand the core concepts and applications of mainstream and advanced semiconductor process technologies after 2010. The content covers basic semiconductor knowledge, main module manufacturing processes, and process integration of two-dimensional planar and three-dimensional fin transistors. The course also introduces key technologies such as stressed silicon channels, high-dielectric gate oxide layers, metal gates, and advanced source-drain engineering, and explains material analysis techniques such as SEM, TEM, XPS, and Raman spectroscopy and their applications. Finally, the course will guide students to understand future technology directions, including GAAFET, CFET, vertical channel components and 3D IC, etc., to establish students' overall understanding of the evolution of semiconductor manufacturing processes.

本課程為奈米電子與能源技術組規劃之基礎積體電路製程專業課程，使學生了解奈米積體電路製造技術的基本知識，並培養其了解半導體產業之實務觀念。希望同學修完這門課程，可以在研究及實務上均有幫助，未來不管是繼續升學及工作都可以具備奈米積體電路製程的知識。

This course is a basic integrated circuit manufacturing professional course planned by the Nanoelectronics and Energy Technology Group. It enables students to understand the basic knowledge of nanometer integrated circuit manufacturing technology and cultivates their understanding of the practical concepts of the semiconductor industry. I hope that after completing this course, students will be able to benefit from both research and practice, and that they will have knowledge of nano-integrated circuit processes whether they continue their studies or work in the future.

半導體製程與整合，吳永俊、孫崇哲、顏孝丞，滄海圖書，2023年

Semiconductor manufacturing process and integration, Wu Yongjun, Sun Chongzhe, Yan Xiaocheng, Canghai Books, 2023