使學生瞭解電子封裝技術其各式結構設計與應用之演進，覆晶構裝技術，晶圓級封裝、三維晶片封裝，以及扇出型封裝結構等。Let students understand the evolution of electronic packaging technology in various structural designs and applications, covering crystal structure technology, round-level packaging, three-dimensional chip packaging, and fan-out packaging structure.
實用IC封裝(2版)， 蕭献賦，五南圖書，2023
Practical IC Packaging (2nd Edition), Discounts, Wunan Book, 2023
| 評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
|---|---|---|
| 出席出席 Attend |
20 | |
| 作業作業 Action |
20 | |
| 期中考期中考 Midterm exam |
25 | |
| 期末報告期末報告 Final report |
30 | |
| 彈性學習彈性學習 Flexibility Learning |
5 |
