5537 - 製程:半導體元件物理與可靠度分析

Semiconductor Device Physics and Reliability Analysis

教育目標 Course Target

本課程旨在深入介紹半導體元件的物理原理,並進一步探討其在實際應用中的可靠度議題與分析方法。學生將學習如何從物理層面理解元件劣化機制、失效模式及可靠度評估技術,為未來從事半導體元件設計、製程整合開發與良率缺陷的可靠度工程建立基礎。

This course aims to provide an in-depth introduction to the physical principles of semiconductor components and further explore its reliability issues and analytical methods in practical applications. Students will learn how to understand component degradation mechanisms, failure modes and reliability evaluation techniques from the physical level, and establish a foundation for future reliability engineering from semiconductor component design, process integration and yield defects.

參考書目 Reference Books

Neamen - Semiconductor Physics And Devices 4E
S.M.Sze - Physics of Semiconductor Devices, Wiley
Neil Goldsman - Semiconductor and Device Physics: A Concise Introduction, Spring
B.JayantBaliga - Fundamentals of Power Semiconductor Devices, Spring 2E
Micron-semiconductor-fundamentals-and-pn-junction-device-physics-presentation

Neamen - Semiconductor Physics And Devices 4E
S.M.Sze - Physics of Semiconductor Devices, Wiley
Neil Goldsman - Semiconductor and Device Physics: A Concise Introduction, Spring
B.JayantBaliga - Fundamentals of Power Semiconductor Devices, Spring 2E
Micron-semiconductor-fundamentals-and-pn-junction-device-physics-presentation

評分方式 Grading

評分項目
Grading Method
配分比例
Percentage
說明
Description
期中考
Midterm exam
25
期中報告
Midterm Report
35
期末分組報告
Final division report
40

授課大綱 Course Plan

點擊下方連結查看詳細授課大綱
Click the link below to view the detailed course plan

查看授課大綱 View Course Plan

相似課程 Related Courses

無相似課程 No related courses found

課程資訊 Course Information

基本資料 Basic Information

  • 課程代碼 Course Code: 5537
  • 學分 Credit: 3-0
  • 上課時間 Course Time:
    Wednesday/3,4,Thursday/5[CME115]
  • 授課教師 Teacher:
    劉建邦
  • 修課班級 Class:
    化材系4,碩1,2
選課狀態 Enrollment Status

目前選課人數 Current Enrollment: 27 人

交換生/外籍生選課登記

請點選上方按鈕加入登記清單,再等候任課教師審核。
Add this class to your wishlist by clicking the button above.