1109 - 感測器原理之視覺感測粒子控制
Sensor Principles for Visual Sensing Particle Control
教育目標 Course Target
課程目標:
本課程「視覺感測粒子控制」旨在培養學生在半導體過程中視覺感測與粒子控制領域的專業知識與實踐能力。透過問題導向學習(PBL)的教學方式,引導學生從理論到實踐,全面掌握視覺感測系統的基本原理、圖像處理技術、顆粒檢測方法以及在半導體行業的應用。
課程首先建立學生對視覺感測系統基本構成的理解,包括光源系統、光學系統、感測元件、圖像處理系統等核心組件的工作原理和特性。接著深入探討影像處理與分析技術,從基本的點處理、區域處理到高階的頻域處理,讓學生掌握影像增強、復原、分割等關鍵技術。在此基礎上,課程聚焦於顆粒檢測技術,介紹從傳統光學方法到先進的激光衍射、動態光散射等多種粒徑分析原理,以及它們在半導體過程潔淨度控制中的應用。
隨著半導體製程技術的不斷進步,視覺檢測在製程中扮演越來越重要的角色。本課程將帶領學生了解視覺檢測在晶圓製造、光罩檢查、封裝測試等環節的具體應用,並探討AI與機器學習如何革新傳統視覺檢測方法,提升檢測精準度與效率。課程也將介紹視覺檢測系統的自動化整合技術,以及如何進行系統測試與驗證,以確保檢測結果的可靠性。
最後,課程透過Arduino軟硬件實踐專題,讓學生親手設計並實現PM2.5顆粒物檢測系統,將理論知識轉化為實際應用能力。學生將學習傳感器選擇、電路設計、程式編寫、數據處理與視覺化等全流程技能,培養解決實際工程問題的能力。
透過本課程的學習,學生將能夠理解並應用視覺感測與粒子控制的核心技術,具備在半導體產業相關崗位的專業素養,並能夠跟隨技術發展趨勢,持續學習與創新,為未來智慧製造領域的發展做出貢獻。
課程特色:
本課程「視覺感測粒子控制」旨在培養學生在半導體過程中視覺感測與粒子控制領域的專業知識與實踐能力。透過問題導向學習(PBL)的教學方式,引導學生從理論到實踐,全面掌握視覺感測系統的基本原理、圖像處理技術、顆粒檢測方法以及在半導體行業的應用。
課程首先建立學生對視覺感測系統基本構成的理解,包括光源系統、光學系統、感測元件、圖像處理系統等核心組件的工作原理和特性。接著深入探討影像處理與分析技術,從基本的點處理、區域處理到高階的頻域處理,讓學生掌握影像增強、復原、分割等關鍵技術。在此基礎上,課程聚焦於顆粒檢測技術,介紹從傳統光學方法到先進的激光衍射、動態光散射等多種粒徑分析原理,以及它們在半導體過程潔淨度控制中的應用。
隨著半導體製程技術的不斷進步,視覺檢測在製程中扮演越來越重要的角色。本課程將帶領學生了解視覺檢測在晶圓製造、光罩檢查、封裝測試等環節的具體應用,並探討AI與機器學習如何革新傳統視覺檢測方法,提升檢測精準度與效率。課程也將介紹視覺檢測系統的自動化整合技術,以及如何進行系統測試與驗證,以確保檢測結果的可靠性。
最後,課程透過Arduino軟硬件實踐專題,讓學生親手設計並實現PM2.5顆粒物檢測系統,將理論知識轉化為實際應用能力。學生將學習傳感器選擇、電路設計、程式編寫、數據處理與視覺化等全流程技能,培養解決實際工程問題的能力。
透過本課程的學習,學生將能夠理解並應用視覺感測與粒子控制的核心技術,具備在半導體產業相關崗位的專業素養,並能夠跟隨技術發展趨勢,持續學習與創新,為未來智慧製造領域的發展做出貢獻。
Course objectives:
This course "Visual Sensing Particle Control" aims to cultivate students' professional knowledge and practical abilities in the field of visual sensing and particle control in semiconductor processes. Through the problem-based learning (PBL) teaching method, students are guided from theory to practice to comprehensively master the basic principles of visual sensing systems, image processing technology, particle detection methods and applications in the semiconductor industry.
The course first establishes students' understanding of the basic components of the visual sensing system, including the working principles and characteristics of core components such as light source systems, optical systems, sensing elements, and image processing systems. Next, image processing and analysis technologies will be discussed in depth, from basic point processing and area processing to advanced frequency domain processing, allowing students to master key technologies such as image enhancement, restoration, and segmentation. On this basis, the course focuses on particle detection technology, introducing various particle size analysis principles from traditional optical methods to advanced laser diffraction, dynamic light scattering, and their applications in semiconductor process cleanliness control.
With the continuous advancement of semiconductor process technology, visual inspection plays an increasingly important role in the process. This course will lead students to understand the specific applications of visual inspection in wafer manufacturing, mask inspection, packaging testing, etc., and explore how AI and machine learning can innovate traditional visual inspection methods and improve inspection accuracy and efficiency. The course will also introduce the automated integration technology of visual inspection systems and how to conduct system testing and verification to ensure the reliability of inspection results.
Finally, the course uses Arduino software and hardware practical topics to allow students to personally design and implement a PM2.5 particle detection system, transforming theoretical knowledge into practical application capabilities. Students will learn full-process skills such as sensor selection, circuit design, programming, data processing and visualization, and develop the ability to solve practical engineering problems.
Through the study of this course, students will be able to understand and apply the core technologies of visual sensing and particle control, acquire professional qualities for relevant positions in the semiconductor industry, and be able to follow technological development trends, continue to learn and innovate, and contribute to the development of the future smart manufacturing field.
Course features:
This course "Visual Sensing Particle Control" aims to cultivate students' professional knowledge and practical abilities in the field of visual sensing and particle control in semiconductor processes. Through the problem-based learning (PBL) teaching method, students are guided from theory to practice to comprehensively master the basic principles of visual sensing systems, image processing technology, particle detection methods and applications in the semiconductor industry.
The course first establishes students' understanding of the basic components of the visual sensing system, including the working principles and characteristics of core components such as light source systems, optical systems, sensing elements, and image processing systems. Next, image processing and analysis technologies will be discussed in depth, from basic point processing and area processing to advanced frequency domain processing, allowing students to master key technologies such as image enhancement, restoration, and segmentation. On this basis, the course focuses on particle detection technology, introducing various particle size analysis principles from traditional optical methods to advanced laser diffraction, dynamic light scattering, and their applications in semiconductor process cleanliness control.
With the continuous advancement of semiconductor process technology, visual inspection plays an increasingly important role in the process. This course will lead students to understand the specific applications of visual inspection in wafer manufacturing, mask inspection, packaging testing, etc., and explore how AI and machine learning can innovate traditional visual inspection methods and improve inspection accuracy and efficiency. The course will also introduce the automated integration technology of visual inspection systems and how to conduct system testing and verification to ensure the reliability of inspection results.
Finally, the course uses Arduino software and hardware practical topics to allow students to personally design and implement a PM2.5 particle detection system, transforming theoretical knowledge into practical application capabilities. Students will learn full-process skills such as sensor selection, circuit design, programming, data processing and visualization, and develop the ability to solve practical engineering problems.
Through the study of this course, students will be able to understand and apply the core technologies of visual sensing and particle control, acquire professional qualities for relevant positions in the semiconductor industry, and be able to follow technological development trends, continue to learn and innovate, and contribute to the development of the future smart manufacturing field.
參考書目 Reference Books
自編
Self-edited
評分方式 Grading
評分項目 Grading Method |
配分比例 Percentage |
說明 Description |
---|---|---|
期中、末考+期中、末小考 Midterm and final exam + midterm and final quiz |
60 | |
兩週一次作業 Homework once every two weeks |
10 | |
課堂點名 Class roll call |
10 | |
2週彈性課程(20%) 2-week flexible course (20%) |
20 |
授課大綱 Course Plan
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課程資訊 Course Information
基本資料 Basic Information
- 課程代碼 Course Code: 1109
- 學分 Credit: 3-0
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上課時間 Course Time:Wednesday/6,7,8[ST020]
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授課教師 Teacher:苗新元
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修課班級 Class:電機系2-4
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