此課程之目的是使學生能夠了解半導體材料與製程之基本概念與程序。

The purpose of this course is to enable students to understand the basic concepts and procedures of semiconductor materials and processes.

1.譯自Hong Xiao(蕭宏),半導體製程技術導論(第三版),全華圖書,2014.
2.劉文超等校閱,半導體製造技術(Quirk),培生,2003.
3.莊達人, VLSI製造技術, 高立圖書有限公司, 台北,2002.
4.菊地正典(譯者：張萍),圖解半導體製造裝置,世茂出版社,2008.
5. Gary S. May and Simon M. Sze, Fundamentals of Semiconductor Fabrication, Wiley-IEEE Press, 2004.
6. Gary S. May and Costas J. Spanos, FUNDAMENTALS OF SEMICONDUCTOR MANUFACTURING AND PROCESS CONTROL,
Wiley-IEEE Press,May 2006.
7. H. Xiao, Introduction to Semiconductor Manufacturing Technology, Prentice Hall, Columbus, Ohio, 2001.
8. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press: New York, 1996
9. S. Middleman and A. K. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, McGraw-Hill, Inc.: New York, 1993

1. Translated from Hong Xiao (Xiao Hong), Semiconductor Processing Technology Discussion (Third Edition), Full Chinese Book, 2014.
2. Liu Wenchao, Semiconductor Manufacturing Technology (Quirk), Pearson, 2003.
3. Zhuangdaren, VLSI Manufacturing Technology, Gaoli Books Co., Ltd., Taipei, 2002.
4. Judita Canon (translated by: Zhang Ping), diagram semiconductor manufacturing device, Shimao Publishing House, 2008.
5. Gary S. May and Simon M. Sze, Fundamentals of Semiconductor Fabrication, Wiley-IEEE Press, 2004.
6. Gary S. May and Costas J. Spanos, FUNDAMENTALS OF SEMICONDUCTOR MANUFACTURING AND PROCESS CONTROL,
Wiley-IEEE Press,May 2006.
7. H. Xiao, Introduction to Semiconductor Manufacturing Technology, Prentice Hall, Columbus, Ohio, 2001.
8. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press: New York, 1996
9. S. Middleman and A. K. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, McGraw-Hill, Inc.: New York, 1993