本課程為介紹半導體元件製作之基本課程,從積體電路介紹與歷史展望、晶體成長、晶圓製造與矽晶圓的基本性質、積體電路製程技術、CMOS製程的介紹,以及未來技術發展的趨勢,使學生能對半導體工程技術有基本的整體概念。This course introduces the basic course of semiconductor component production, from the introduction of integral circuits and historical prospects, crystal growth, the basic properties of crystal circle manufacturing and silicon wafers, the introduction of integral circuit processing technology, CMOS process, and future technological development Trends enable students to have basic overall concepts of semiconductor engineering technology.
蕭 宏，半導體製程技術導論，第四版，全華圖書，2024.04
Zimao, Semiconductor Processing Technology Discussion, Fourth Edition, Full Chinese Book, 2024.04
| 評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
|---|---|---|
| 出席出席 Attend |
20 | |
| 作業作業 Action |
10 | |
| 期中考期中考 Midterm exam |
30 | |
| 期末考期末考 Final exam |
30 | |
| 彈性學習彈性學習 Flexibility Learning |
10 |
