講解半導體物理及製程的基本觀念及其相關應用,使學生具備進行相關研究的基礎。
課程內容包括:
1. 半導體物理簡介
2. 積體電路 (Integrated Circuit)
3. 矽晶圓製造 (Wafer Fabrication)
4. 清洗技術 (Cleaning Technology)
5. 氧化 (Oxidation)
6. 薄膜技術 (Thin Film Technology)
7. 真空技術 (Vacuum Technology)
8. 熱蒸鍍及濺鍍 (Evaporation and Sputtering)
9. 化學氣相沉積 (Chemical Vapor Deposition)
10. 微影技術 (Photolithography)
11. 蝕刻 (Etching)
12. 雜質植入 (Diffusion and Ion Implantation)Explain the basic concepts of semiconductor physics and processes and their related applications, so that students can provide basic research for related research.
Course content includes:
1. Introduction to semiconductor physics
2. Integrated Circuit
3. Silicon Round Manufacturing (Wafer Fabrication)
4. Cleaning Technology
5. Oxidation
6. Thin Film Technology
7. Vacuum Technology
8. Evaporation and Sputtering
9. Chemical Vapor Deposition
10. Photolithography
11. Etching
12. Diffusion and Ion Implantation
1. 講義
2. Semiconductor Devices-physics and technology, S.M. Sze
3. 太陽電池, 五南出版社
1. Lecture
2. Semiconductor Devices-physics and technology, S.M. Sze
3. Solar Battery, Wunan Publishing House
評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
---|---|---|
作業作業 Action |
20 | |
小考小考 Small exam |
20 | 不定時隨堂測驗 |
期中,期末考期中,期末考 Midterm, final exam |
60 |