使學生瞭解電子封裝技術其各式結構設計與應用之演進，覆晶構裝技術，晶圓級封裝、三維晶片封裝，以及扇出型封裝結構等。To enable students to understand the evolution of various structural designs and applications of electronic packaging technology, flip-chip construction technology, wafer-level packaging, three-dimensional chip packaging, and fan-out packaging structures.
先進微電子3D-IC 構裝（4版），許明哲，五南圖書，2020年
Advanced Microelectronics 3D-IC Construction (4th Edition), Xu Mingzhe, Wunan Books, 2020
| 評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
|---|---|---|
| 出席及上課態度出席及上課態度 Attendance and class attitude |
20 | |
| 作業作業 Homework |
20 | |
| 期中考期中考 midterm exam |
30 | |
| 期末考期末考 final exam |
30 |
