使學生瞭解電子封裝技術其各式結構設計與應用之演進，覆晶構裝技術，晶圓級封裝、三維晶片封裝，以及扇出型封裝結構等。Let students understand the evolution of electronic packaging technology in various structural designs and applications, covering crystal structure technology, round-level packaging, three-dimensional chip packaging, and fan-out packaging structure.
先進微電子3D-IC 構裝（4版），許明哲，五南圖書，2020年
Advanced Microelectronics 3D-IC structure (4th edition), Xu Mingzhe, Wunan Book, 2020
| 評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
|---|---|---|
| 出席及上課態度出席及上課態度 Attendance and class attendance |
20 | |
| 作業作業 Action |
20 | |
| 期中考期中考 Midterm exam |
30 | |
| 期末考期末考 Final exam |
30 |
