課程目標:
1.本課程內容部分包含薄膜、微影、蝕刻、金屬化…。
2.本課程介紹半導體物理及製造技術及如何應用在半導體產業。
3.本課程期望讓學生了解半導體元件與積體電路製造技術之實務，並有利於同學日後在積體電路相關的研究與就業。Course Target:
1. The content of this course includes film, micro-shading, etching, metallization...
2. This course introduces semiconductor physics and manufacturing technology and how to apply it to semiconductor industries.
3. This course hopes that students can understand the practice of semiconductor components and integrated circuit manufacturing technology, and will be conducive to the future study and employment of integrated circuits in the future.
半導體製程技術導論，Hong Xiao著，羅正忠、張鼎張譯，台灣培生教育出版股份有限公司
2. 半導體元件物理與製作技術-第三版，作者：施敏、李明逵
Semiconductor Processing Technology Conductor, by Hong Xiao, Luo Zhengzhong and Zhang Ding Zhang Lu, Taiwan Pesheng Education Publishing Co., Ltd.
2. Semiconductor Component Physics and Production Technology-Third Edition, Authors: Shi Min, Li Mingkui
| 評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
|---|---|---|
| 期中考期中考 Midterm exam |
40 | |
| 期末報告期末報告 Final report |
50 | |
| 出席率出席率 Attendance rate |
10 |
