課程目標:
1.本課程內容部分包含薄膜、微影、蝕刻、金屬化…。
2.本課程介紹半導體物理及製造技術及如何應用在半導體產業。
3.本課程期望讓學生了解半導體元件與積體電路製造技術之實務，並有利於同學日後在積體電路相關的研究與就業。Course objectives:
1. The content of this course includes thin film, lithography, etching, metallization...
2. This course introduces semiconductor physics and manufacturing technology and how they are applied in the semiconductor industry.
3. This course hopes to allow students to understand the practical aspects of semiconductor component and integrated circuit manufacturing technology, and to facilitate students' future research and employment in integrated circuits.
半導體製程技術導論，Hong Xiao著，羅正忠、張鼎張譯，台灣培生教育出版股份有限公司
2. 半導體元件物理與製作技術-第三版，作者：施敏、李明逵
Introduction to Semiconductor Process Technology, written by Hong Xiao, translated by Luo Zhengzhong, Zhang Ding and Zhang, Pearson Education Publishing Co., Ltd. Taiwan
2. Semiconductor Component Physics and Manufacturing Technology - Third Edition, Author: Shi Min, Li Mingkui
| 評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
|---|---|---|
| 期中考期中考 midterm exam |
40 | |
| 期末報告期末報告 Final report |
50 | |
| 出席率出席率 Attendance |
10 |
