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化學工程與材料工程學系
course information of 106 - 2 | 0913 Introduction to Semiconductor Processes(製程:半導體製程概論)

Taught In English0913 - 製程:半導體製程概論 Introduction to Semiconductor Processes


教育目標 Course Target

此課程之目的是使學生能夠了解半導體材料與製程之基本概念與程序。The purpose of this course is to enable students to understand the basic concepts and procedures of semiconductor materials and processes.


課程概述 Course Description

此課程之目的是使學生能夠了解半導體材料與製程之基本概念與程序。
The purpose of this course is to enable students to understand the basic concepts and procedures of semiconductor materials and processes.


參考書目 Reference Books

1.劉文超等校閱,半導體製造技術(Quirk),培生,2003.
2.菊地正典(譯者:張萍),圖解半導體製造裝置,世茂出版社,2008.
3.譯自Hong Xiao(蕭宏),半導體製程技術導論(第三版),全華圖書,2014.
4.莊達人, VLSI製造技術, 高立圖書有限公司, 台北,2002.

5. Gary S. May and Simon M. Sze, Fundamentals of Semiconductor Fabrication, Wiley-IEEE Press, 2004.
6. Gary S. May and Costas J. Spanos, FUNDAMENTALS OF SEMICONDUCTOR MANUFACTURING AND PROCESS CONTROL,
Wiley-IEEE Press,May 2006.
7. H. Xiao, Introduction to Semiconductor Manufacturing Technology, Prentice Hall, Columbus, Ohio, 2001.
8. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press: New York, 1996
9. S. Middleman and A. K. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, McGraw-Hill, Inc.: New York, 1993
1. Liu Wenchao and other schools read, semiconductor manufacturing technology (quirk), Peizheng, 2003.
2. Ju Di Zhengdian (translator: Zhang Ping), diagram semiconductor manufacturing device, Shimao Publishing House, 2008.
3. Translated from hong xiao (Xiao Hong), Introduction to the Semiconductor System Program Technology (Third Edition), Quanhua Books, 2014.
4. Zhuangda, VLSI manufacturing technology, Gao Li Book Co., Ltd., Taipei, 2002.

5. Gary S. May and Simon M. SZE, Fundamentals of Semiconductor Fabrication, Wiley-Ieee Press, 2004.
6. Wiley-Ieee Press, May 2006.
7. H. Xiao, IntRoduction to Semiconductor ManuFacturing Technology, Prentice Hall, Columbus, Ohio, 2001.
8. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press: New York, 1996
9. S. Middleman and A. K. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, McGraw-Hill, Inc.: New York


評分方式 Grading

評分項目 Grading Method 配分比例 Grading percentage 說明 Description
期中考期中考
Secondary entrance examination
30
期末考期末考
Final exam
30
出席,作業與報告出席,作業與報告
Attendance, homework and report
40

授課大綱 Course Plan

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Course Information

Description

學分 Credit:0-3
上課時間 Course Time:Monday/5,Thursday/1,2[A106]
授課教師 Teacher:林大溱
修課班級 Class:化材系3,4
選課備註 Memo:
This Course is taught In English 授課大綱 Course Plan: Open

選課狀態 Attendance

There're now 37 person in the class.
目前選課人數為 37 人。

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