課程概述 (系所共同性目標)
. 本課程為奈米電子與能源技術組規劃之基礎積體電路製造技術專業課程，使學生了解積體電路製造技術的基本知識，並培養其了解半導體產業之實務。希望同學修完這門課程，可以在未來的研究及實務上幫助，未來不管是繼續升學及工作都可以從事與積體電路產業相關的研究或行業。
課程目標:
1.本課程內容部分包含薄膜、微影、蝕刻、金屬化…。
2.本課程介紹半導體物理及製造技術及如何應用在半導體產業。
3.本課程期望讓學生了解半導體元件與積體電路製造技術之實務，並有利於同學日後在積體電路相關的研究與就業。

Course Overview (Common Objectives of the Department)
. This course is a basic integrated circuit manufacturing technology professional course planned by the Nanoelectronics and Energy Technology Group. It enables students to understand the basic knowledge of integrated circuit manufacturing technology and cultivates their understanding of the practical practices of the semiconductor industry. I hope that after completing this course, students will be able to help with future research and practice. Whether they continue their studies or work in the future, they can engage in research or industry related to the integrated circuit industry.
Course objectives:
1. The content of this course includes thin film, lithography, etching, metallization...
2. This course introduces semiconductor physics and manufacturing technology and how they are applied in the semiconductor industry.
3. This course hopes to enable students to understand the practical aspects of semiconductor component and integrated circuit manufacturing technology, and to facilitate students’ future research and employment in integrated circuit related fields.

1. 半導體製程技術導論，Hong Xiao著，羅正忠、張鼎張譯，台灣培生教育出版股份有限公司
2. 半導體元件物理與製作技術-第三版，作者：施敏、李明逵

1. Introduction to Semiconductor Process Technology, written by Hong Xiao, translated by Luo Zhengzhong, Zhang Ding and Zhang, Pearson Education Publishing Co., Ltd. Taiwan
2. Semiconductor Component Physics and Manufacturing Technology - Third Edition, Author: Shi Min, Li Mingkui