課程的安排上順序是：
1． 原子結構：以便於了解各種原子之相似性以及差異性。
2． 原子鍵結：以便於了解材料性質之相似性以及差異性。
3． 晶體結構與非晶質構造：以便於了解材料性質之相似性與差異性原自於原子排列的不 同。
4． 材料的物性: 材料對於環境的響應，例如：力學、電性與磁性分別對於機械、電力與磁力的響應。其他重要的特性，如熱(熱傳導與熱容量)、光學(吸收、傳輸與散射的光)以及接觸的環境(如耐腐蝕性)的化學穩定性。
5． 半導體材料：
6． 半導體元件
7． 材料之選擇

The sequence of courses is:
1. Atomic structure: To understand the similarities and differences of various atoms.
2． Atomic bonding: To understand the similarities and differences in material properties.
3． Crystal structure and amorphous structure: In order to understand that the similarities and differences in material properties originate from the differences in atomic arrangement.
4. Physical properties of materials: The response of materials to the environment, such as the mechanical, electrical and magnetic responses to mechanical, electrical and magnetic forces respectively. Other important properties are thermal (heat conduction and heat capacity), optical (absorption, transmission and scattered light) and chemical stability to the environment in which it is exposed (e.g. corrosion resistance).
5. Semiconductor materials:
6. Semiconductor components
7. Material selection

材料科學主要為探討與研究材料構造、特性與製程間之關係；材料工程則注重材料應用知識，其以材料科學之本質為基礎來設計或管理材料之結構，以製成預定之性質，本課程規畫介紹材料之結構、性質、性能與製程等四部份間之關係。

Materials science mainly explores and studies the relationship between material structure, properties and manufacturing processes; materials engineering focuses on material application knowledge, which is based on the essence of materials science to design or manage the structure of materials to achieve predetermined properties. This course plans to introduce the relationship between the four parts of materials: structure, properties, performance and manufacturing processes.

“Foundations of Materials Science and Engineering”, 4rd edition, William F. Smith

"Foundations of Materials Science and Engineering", 4th edition, William F. Smith