此課程之目的是使學生能夠了解半導體材料與製程之基本概念與程序。The purpose of this course is to enable students to understand the basic concepts and procedures of semiconductor materials and processes.
此課程之目的是使學生能夠了解半導體材料與製程之基本概念與程序。
The purpose of this course is to enable students to understand the basic concepts and procedures of semiconductor materials and processes.
1.劉文超等校閱,半導體製造技術(Quirk),培生,2003.
2.菊地正典(譯者：張萍),圖解半導體製造裝置,世茂出版社,2008.
3.譯自Hong Xiao(蕭宏),半導體製程技術導論(第三版),全華圖書,2014.
4.莊達人, VLSI製造技術, 高立圖書有限公司, 台北,2002.
5. Gary S. May and Simon M. Sze, Fundamentals of Semiconductor Fabrication, Wiley-IEEE Press, 2004.
6. Gary S. May and Costas J. Spanos, FUNDAMENTALS OF SEMICONDUCTOR MANUFACTURING AND PROCESS CONTROL,
Wiley-IEEE Press,May 2006.
7. H. Xiao, Introduction to Semiconductor Manufacturing Technology, Prentice Hall, Columbus, Ohio, 2001.
8. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press: New York, 1996
9. S. Middleman and A. K. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, McGraw-Hill, Inc.: New York, 1993
1. Reviewed by Liu Wenchao, Semiconductor Manufacturing Technology (Quirk), Pearson, 2003.
2. Masanori Kikuchi (Translator: Zhang Ping), Illustrated Semiconductor Manufacturing Equipment, Shimao Publishing House, 2008.
3. Translated from Hong Xiao, Introduction to Semiconductor Process Technology (Third Edition), Quanhua Books, 2014.
4. Zhuang Daren, VLSI Manufacturing Technology, Gaoli Book Co., Ltd., Taipei, 2002.
5. Gary S. May and Simon M. Sze, Fundamentals of Semiconductor Fabrication, Wiley-IEEE Press, 2004.
6. Gary S. May and Costas J. Spanos, FUNDAMENTALS OF SEMICONDUCTOR MANUFACTURING AND PROCESS CONTROL,
Wiley-IEEE Press,May 2006.
7. H. Xiao, Introduction to Semiconductor Manufacturing Technology, Prentice Hall, Columbus, Ohio, 2001.
8. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press: New York, 1996
9. S. Middleman and A. K. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, McGraw-Hill, Inc.: New York, 1993
| 評分項目 Grading Method | 配分比例 Grading percentage | 說明 Description |
|---|---|---|
| 期中考期中考 midterm exam |
35 | |
| 期末考期末考 final exam |
35 | |
| 作業與報告作業與報告 Assignments and reports |
30 |
